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SWISSto12 raises $70M to scale manufacturing capacity amid booming space market

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Satellite with deployed solar panels against a dark background.
Swiss satellite and payload manufacturer announces close of Series C on the back of 110% CAGR since 2022 and a total of more than $500 million in contracted orders.

Swiss satellite maker fuels growth with new capital, driving AM adoption across multi-orbit platforms

SWISSto12 has closed a $70 million Series C funding round, underscoring investor confidence in the Swiss payload and satellite manufacturer. The milestone comes as the company reaches $140 million in annual revenue (2025) and secures over $500 million in contracted orders, fueled by sustained demand for advanced, multi-orbit solutions that rely on additive manufacturing at their core.

“Space is increasingly recognized as essential infrastructure for the global economy,” CEO Emile de Rijk said in a statement. “In this expanding market, our solutions across payload and satellite lines are creating significant new opportunities for customers. Our products are supporting exciting new customer missions, from direct-to-device connectivity to media broadcasting, intersatellite data relays or sovereign communications infrastructure, many of which span multiple orbits. This Series C funding round accelerates our ability to execute on this growing demand across any payload, any platform and any orbit.”

SWISSto12 leverages patented additive manufacturing technologies to design and manufacture advanced satellite payloads and RF (radio frequency) components that can be deployed across multiple orbital platforms.

From AM development to orbital deployment

Since its Series B funding in 2019, which explicitly targeted 3D-printed payload capabilities, the company has expanded AM applications from proof-of-concept into production-critical systems.

Its portfolio spans HummingLink multi-orbit payload solutions (with over 2,000 solutions now deployed in orbit across active space missions) and bespoke RF products developed through strategic partnerships, including a collaboration with CAES to deliver 3D-printed RF solutions supported by dedicated additive manufacturing laboratories.

By using AM for both design complexity and manufacturing efficiency, SWISSto12 has compressed development cycles and reduced weight. It has done so while maintaining the structural and thermal performance required for satellite missions.

This approach has positioned the company to serve diverse customer missions, from direct-to-device connectivity to intersatellite data relays. Those missions span LEO constellations, GEO platforms, and hybrid architectures that would be economically unfeasible through traditional manufacturing methods.

Source: SWISSto12 — Series C announcement, 16 July 2026.

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