3D printed electronics specialist Nano Dimension joins Techniplas Open Innovation Program

Just like Nexa3D, Nano Dimension announced it joined Techniplas Open Innovation Program. The 3D printed electronics specialist aims at making available to the automotive industry additive manufacturing of conductive components, encapsulated sensors and smart surfaces.

As a reminder, Techniplas is a design and manufacturing provider of automotive products and services.

The strength of this partnership

Techniplas’ cognitive lighting technology and Nano Dimension’s 3D printed electronics will be put together to deliver new ways of designing and manufacturing electronic conductive paths directly into the interior on the one hand, on the other hand, to achieve surfaces of cars in a single step.

Nano Dimension marks a premiere in the industry by embedding conductive paths and print antennas into shapes. As part of this partnership, the company will then bring its industrial DragonFly 2020 Pro 3D Printer into the Techniplas additive manufacturing Innovation Center, and apply its extensive advanced inkjet engineering materials expertise to accelerate the development of next-generation cognitive connected vehicle parts, components, and systems.

We are thrilled to welcome Nano Dimension as a member of our program which brings together today’s best and most innovative players and technologies, said Techniplas founder and chairman George Votis. “With Nano Dimension on board, we are the first to bring additive electronics capabilities to our automotive customers.”

Techniplas‘ open innovation program is fast becoming the preeminent hub for innovative 3D printing companies to validate and mainstream their additive manufacturing solutions for the automotive industry,” said Nano Dimension CEO Amit Dror. “Together, we plan to lay the foundation for a new era of connected mobility and automotive products that are unencumbered by traditional design and manufacturing restrictions.

Innovative partners such as DWS, Sharebot and Sicnova also join the Techniplas’ Open Innovation Program, to push the traditional boundaries of automotive manufacturing forward.

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