OEM 3D printer manufacturer Farsoon continues to make progress on a path that gives more and more place to open platform systems. Its latest technology is an UT252P polymer 3D printer with a key capability: processing materials with high melting point over 340°C.
In case you do not know, the OEM first launches a high-temperature polymer laser powder bed fusion 3D printer in 2014. It was the 252P platform. Over time, demand on the market led the company to focus on an open platform strategy to meet a wide range of needs.
As a reminder, the 252P platform could process materials with a melting point of 280°C. These materials include for instance PA11, CF, ESD, TPU, PP, PBT, PA6, and PPS, and PA66.
The new 3D printer goes one step further as it integrates an ultra-temperature configuration with even higher chamber temperature capacity of processing materials. It is also equipped with a versatile build envelope of 250×250×320mm and powerful 100W CO2 laser. Furthermore, the enhanced 8-zone temperature shielding, and thermal control enable the machine to process high-temperature, high-performance engineering materials such as PA6, PA66, PPS, PAEK, PI, PTFE for end-use applications in sectors such as medical, aerospace and more.
With our philosophy of developing truly open platform systems, Farsoon’s polymer application team has been collaborating with multiple material supplier on material optimization of high temperature powder material for LPBF process, with recent success of sintering one PAEK family material with high melting point over 340°C, features excellent chemical and thermal resistance, low moisture uptake, and good fire-resistant, and higher wear resistance. During the Beta testing, the parts produced on UT252P featuring repeatable results in thermal stability, surface quality and mechanical properties. Meanwhile, with the powder optimization, the material can achieve a low refresh rate with great potential for reduced material cost and true sustainable manufacturing process, the company says in a press release.
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