Solvay marks a mile in the 3D printing industry with the launch of 3 polymer filaments that would bring added value to 3D printed parts.
It should be noted that the company first drew our attention with the launch of its “AM Cup 3D printing challenge”.
The materials are based on the manufacturer’s KetaSpire® PEEK and Radel® PPSU polymers. There are the first products in the list of specialty polymer filaments and powders the company would bring on the market for AM applications.
KetaSpire® polyetheretherketone (PEEK) polymer is a neat PEEK product and a 10-percent carbon fiber-reinforced grade. Both PEEK filaments would enable a very good fusion of printed layers, high part density and deliver exceptional part strength – including in the z-axis.
The third new filament is based on Solvay’s Radel® polyphenylsulfone (PPSU). It has the capacities to allow excellent fusion of layers, this high-performance PPSU material offers high transparency, excellent elongation and superior toughness for 3D printed parts.
In the long run, the advanced materials and chemical company is committed to developing an AM-ready powder based on its NovaSpire® polyetherketoneketone (PEKK) polymer, which will target AM applications in aerospace and healthcare.
“Solvay’s new AM filaments signal an important convergence between additive manufacturing and specialty polymers technology, which is needed to deliver on the promise of high-end 3D printing,” said Christophe Schramm, business manager for additive manufacturing at Solvay’s Specialty Polymers global business unit. “With today’s launch, Solvay is laying the foundation of its strategy to become the leading global supplier of advanced AM-ready polymer solutions for 3D printing technologies. We’re also collaborating with leading industry innovators in printing, process and design to develop new material solutions based on our specialty polymers portfolio.”
The site will also serve as portal to a series of simulation, testing, and prototyping services that leverage Solvay’s growing partner network and open ecosystem approach.
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