ams is a supplier of high- performance sensor solutions, and Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated. Both companies will join forces to develop a 3D depth sensing camera solution for mobile phone applications.
Such engineering efforts are often related to 3D imaging, 3D scanning and the integration of biometric face authentification, a subject that is already being tackled by companies such as SensibleVision, Idemia or Sony.
With ams’ advanced VCSEL light sources and optical IR pattern technology incorporating mass- production proven wafer level optics and Qualcomm® Snapdragon™ Mobile Platforms, the companies have a goal to create a reference design for a cost-attractive, active 3D stereo camera solution for Android-based mobile phones. Use cases for the platform solution could include front-facing applications that require advanced 3D imaging such as face recognition required for secure online payments as well as other applications like dynamic-depth facial scanning.
Alexander Everke, CEO of ams, commented on the announcement, “ams provides the full range of IR illumination devices specifically designed to address the three 3D technologies Active Stereo Vision, Structured Light and Time-of-Flight (ToF). Utilizing this leading capability together with Qualcomm Technologies’ mobile application processors for active stereo camera solutions is an exciting opportunity. We want to enable fast time-to-commercialization and broad-based availability of high quality 3D sensing solutions for Android-based smartphones and mobile devices, and this is a step towards this goal.”
For further information about 3D Printing, follow us on our social networks and subscribe to our newsletter!
Would you like to be featured in the next issue of our digital magazine? Send us an email at email@example.com