Solvay strengthens the neat KetaSpire® PEEK AM filament for 3D Printing simulation

In April 2018, the launch of Solvay’s 3 polymeric filaments was directly followed by a partnership with e-Xstream engineering. As part of this partnership, Solvay should offer 3D print simulation solutions to the software publisher. The partnership raised a lot of interest because the proposed solutions were intended to increase the number of specialty polymers available for simulation on e-Xstream’s Digimat® platform.

Today, there is a significant step forward in Solvay’s work, which has reinforced the KetaSpire® PEEK AM filament already available on the platform. The chemical specialist has added 10% carbon fiber filled KetaSpire® polyetheretherketone (PEEK) and neat Radel® polyphenylsulfone (PPSU) to e-Xstream engineering’s latest release (2019.0) software.

Our growing range of AM filaments underscores Solvay’s determination to establish itself as an industry leader in this rapidly evolving market,” says Christophe Schramm, Additive Manufacturing business manager in the company’s Specialty Polymers global business unit. “Digimat®-AM allows customers to simulate the printing process and successfully predict the thermomechanical behaviour of 3D-printed designs in order to ‘print right the first time’.”

With the addition of Solvay’s new AM grades, we now have a wider portfolio of 3D printing grades in Digimat® to provide cutting-edge new materials to push the design and application boundaries in this dynamic market,” adds Roger Assaker, CEO of e-Xstream engineering and Chief Material Strategist for MSC Software. “As a result of our partnership, we bridge the gap in simulation engineering between high-performance polymers and demanding printing processes such as Fused Filament Fabrication.”


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