With the expansion to copper thermal solutions alongside its existing aluminum offerings, Alloy now provides cooling components that meet ASHRAE standards for chemical compatibility while enabling the extreme cooling demands of next-generation high-performance computing and high-density AI workloads.
As chip power densities and thermal design power rise—pushing AI server rack power densities beyond 120 kW—traditional cooling methods are reaching their limits. To address this challenge, Alloy Enterprises, a manufacturer of direct liquid-cooled components that we first discovered as a material producer, introduces its novel Stack Forging™ process.
The new copper direct liquid cooling (DLC) solution targets liquid cooling where heat loads are highest, ensures up to 10x reduction in pressure drop, enabling smaller pumps and energy savings, and removes leak points common in traditional liquid cooling systems thanks to its single-piece construction.
“Alloy Enterprises is setting a new standard in direct liquid cooling technology with our proprietary Stack Forging process,” said Ali Forsyth, PhD., CEO and Co-founder of Alloy Enterprises. “We now deliver industry-leading thermal performance in both aluminum and copper, enabling higher rack densities, significant cost savings and greater sustainability. With 600 kW racks on the horizon, the shift to liquid cooling is no longer optional—it’s mission-critical.”
Particularities of the copper direct liquid cooling solution
Alloy’s Stack Forged DLC components provide the thermal performance needed to meet these escalating demands in thermal design power. With superior pressure drop reduction, data centers can use 44 °C (111.2°F) water and smaller pumps, eliminating the need for refrigerated HVAC systems. The result is a reduction in data center energy consumption by up to 23%, dramatically improving both sustainability and profitability.
For hyperscalers and colocation providers, these efficiency gains translate directly to increased revenue and reduced costs. More efficient cooling means more AI tokens can be sold with significantly lower energy costs. Additionally, Alloy’s thermal solutions help maximize compute density per square foot, improve power usage effectiveness (PUE), and reduce total cost of ownership.
The company’s copper DLC cold plates are already available for commercialization.
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