TRUMPF’s Additive Manufacturing (AM) technology enables the manufacturing of precise and efficient semiconductor manufacturing systems.
Marco Andreetta from TRUMPF states, “Semiconductor manufacturers can reduce scrap and cut costs with AM technology. The modern approach of using additive manufactured parts enhances the functionality and precision of semiconductor manufacturing machines and paves the way for efficient production processes. With AM technology, suppliers of Semicon equipment can avoid the complex manufacturing assembly and consolidate several parts into one, improving yield and reliability.”
The chip manufacturing sector needs machines operating with optimal precision, higher repeatability, and other performance features in the nanometer range. Even the tiniest changes can lead to defective chips, i.e. expensive scrap.
At Formnext 2024, Frankfurt, TRUMPF will showcase 3D printed sample parts for the semicon sector, like manifolds deployed in water and gas lines of semiconductor manufacturing devices.
The complex machines in the semiconductor sector depend on the precision of each specific component. Fluid and gas manifolds are some examples. Due to their design, the traditional manufacturing process of complex fluid manifolds results in heavy parts with irregular fluid flow, static zones, and leakage issues.
As a result, the final pressure would dip and the flow-induced vibration can impact the semiconductor capital equipment negatively. Manifold optimization can enhance the overall performance of semiconductor manufacturing machines. AM technology from TRUMPF can produce this part with improved rigid features and reduced weight so that it meets the high-performance requirements of semiconductor manufacturing.
3D printed fluid manifolds have reduced pressure dips, fewer mechanical disruptions, and low flow-induced vibration. The geometrical flexibility of Additive Manufacturing can eliminate possible leakage points while enhancing part performance and reliability.
To enhance the manufacturing process in this application, TRUMPF’s users can rely on the company’s automatic multi-laser alignment (AMA) and melt pool monitoring solutions. Compatible with the TruPrint 3D printers, these solutions help to automate online monitoring and ensure the laser beam-based position correction of the laser beam paths.
TRUMPF will unveil the second release of the AMA system at Formnext 2024. The patented system visually captures the position of master and slave by rectifying the second one. The process is done between specific layers’ production with set intervals determined by the user preferences.
Lastly, TRUMPF technology also controls the melt pool in real-time during the printing operation to reduce expensive non-destructive tests (NDT) including computer tomography (CT) scans of the component.
Author: Nagarjun M
Remember, you can post free-of-charge job opportunities in the AM Industry on 3D ADEPT Media or look for a job via our job board. Make sure to follow us on our social networks and subscribe to our weekly newsletter: Facebook, Twitter, LinkedIn & Instagram! If you want to be featured in the next issue of our digital magazine or if you hear a story that needs to be heard, make sure to send it to contact@3dadept.com.