HENSOLDT and Nano Dimension achieve a milestone by utilizing electronics 3D printing in the development process of high-performance electronics components.
HENSOLDT provides sensor solutions. The company started working with Nano Dimension’s DragonFly 3D printing system in 2016, in order to examine the possibilities of 3D printing electronics. Last year, HENSOLDT was the first company to test the DragonFly Lights-Out Digital Manufacturing (LDM) printing technology. As a reminder, HENSOLDT contributed by generating reference circuits to outline the advantages of the new LDM system.
Utilizing a newly developed dielectric polymer ink and conductive ink from Nano Dimension, HENSOLDT assembled a 10-layer printed circuit board (PCB) which carries high-performance electronic structures soldered to both outer sides. Until now, 3D printed boards could not bear the soldering process necessary for two-sided population of components.
“Military sensor solutions require performance and reliability levels far above those of commercial components.” says HENSOLDT CEO, Thomas Müller. “To have high-density components quickly available with reduced effort by means of 3D printing gives us a competitive edge in the development process of such high-end electronic systems.”
Additively Manufactured Electronics (AME) are useful to verify a new design and functionality of specialized electronic components before production. AME is a highly agile and individual engineering methodology to prototype a new electronic circuitry. This leads to significant reduction of time and cost in the development process. Furthermore, AME allows for a verified and approved design before production starts, leading to higher quality of the final product.
“Nano Dimension’s relationship with HENSOLDT is the type of partnership with customers we are striving for,” commented Yoav Stern, Nano Dimension President & CEO. “Working together and learning from HENSOLDT led us to reach a first-of-its-kind in-depth knowledge of polymer materials applications. Additionally, it guided us in the development of Hi-PEDs (High Performance Electronic Device) that create competitive edges by enabling unique implementations with shortest time to market.”
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