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Qualifying high-value metal 3D-printed parts: here is how engineers can know what happens before the build begins

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Large copper component on a build plate in an AMCM metal printing system.
3. amcm_nozzle_geometry_annotated

Erik Denlinger, Co-Founder and Chief Engineer at PanOptimization, is among those who believe that “if manufacturers want to print and qualify high-value metal AM parts with confidence, they need physics-based models that help them understand and optimize what will happen before the build begins.”

To predict heat buildup and distortion and correct for them while preparing a build, machine manufacturer AMCM has connected EOSPRINT, the EOS software used to prepare builds for its large metal printers, with PanOptimization’s PanX simulation software.

PanX is a simulation and optimization platform for metal AM. The platform targets large, geometrically complex components in LPBF and DED, parts where conventional simulation tools reach their limits.

Read more in this issue of 3D ADEPT Mag: To qualify high-value metal 3D printed parts, here is how engineers can know what happens before the build begins

The AMCM case is just an example of how integration can occur. Engineers can use PanX as a stand-alone thermomechanical simulation tool alongside any metal AM system.

 The integration into EOSPRINT underscores the importance of thermomechanical simulation to counteract overheating and thermally induced distortion.  Such integration helps bring simulation directly into the build preparation workflow.

Thermal simulation comparing normal and PanX-optimised dwell times.

How exactly does it work?

According to PanOptimization, the integration works by first reading an openjz file from EOSPRINT into PanX and extracting all build setup information, including the geometries, build plate layout, and processing parameters, needed for a simulation.

The EOSPRINT API brings additional information into PanX that the openjz does not include. Accurate simulation still needs this information, such as processing time per layer. This removes redundant and error-prone set-up work and supports turnaround times measured in hours. It also makes simulation more accessible to design and manufacturing engineers rather than only dedicated simulation experts.

 It also improves model accuracy by incorporating high-fidelity printer-specific information.

EOSPRINT build preparation linked to a PanX thermal simulation.
AMCM aerospike component beside its finite-element mesh in PanX.

After a simulation is complete, the integration automatically writes optimized dwell times and compensated geometries back into the openjz file. It also writes optimized laser powers as a TIFF image stack and corresponding Smart Fusion Replay file. Users can then implement them directly on the printer. The EOSPRINT/PanX integration is beneficial for all EOS users, from those running M290-class systems through to users of the AMCM M 8K.

AMCM recently demonstrated these benefits on a large M 8K build. It highlighted how local heat accumulation can lead to distortion and dimensional deviations, residual stress and internal defects, reduced part quality, partially sintered powder, and difficult de-powdering. Thermal simulation helps identify hotspots before the build starts and makes critical areas visible. Engineers can therefore address overheating before it impacts part quality.

“No amount of density-cube or tensile-bar testing can solve these problems, as they are highly geometry- and thermal-history-dependent,” says Denlinger. “That is why simulation is needed.”

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