CRP Technology has unveiled a new 3D printing material for HSS Technology (High Speed Sintering process). Named Windform® P2, the material is a a glass fiber reinforced thermoplastic polyamide material.
Engineer Franco Cevolini, CRP Technology CTO and VP, states: “Windform® P2 is the second polymer from P-LINE, the new Windform® range of materials for high speed production-grade 3D printing, introduced on the market less than a year ago. ”
As a reminder, Windform® P1 is the first material from the P-LINE family of the manufacturer. The new material distinguishes itself from its predecessor by its increased mechanical properties: increased stiffness (Windform® P2 Tensile Modulus is 2925.20 MPa whereas Windform® P1 is 1960.60 MPa), combined to high tensile strength (39.24 MPa, Windform® P2).
“This is – Engineer Franco Cevolini adds – a very important property. Windform® P2 is stiffer than Windform® P1 because Windform® P2 is reinforced (Windform® P1 is not reinforced). Most of the reinforced materials for similar technologies currently on the market, show a decrease in the tensile strength property. My staff and I have been able to preserve the high tensile strength in Windform® P2. Therefore, Windform® P2 overall’s performance is superior than the performance of similar materials currently on the market for similar technologies. ”
As Windform® P2 is glass fiber filled, it is an insulating material (CTI rating of 600).
The material would be ideal for the manufacturing of parts that require detailed resolution such as small functional prototypes, end-use parts requiring high stiffness across a variety of sectors (Electrical (enclosures and housing for electronics), Consumer and household goods, Industrial products (furniture parts, presentation models, fixtures and tooling), Automotive (rigid parts for interior design)).
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