HP’s 3D Technology will revolutionize the footwear market

HP will launch the FitStation platform to propose individual shoe and insole recommendations and 3D printed insoles.

The FitStation Platform

HP’s 3D technology incorporates 3D scanning as well as dynamic gait analysis.

With its new hardware and software platform, HP captures 3D scans. The 3D scanning enables to measure the customer’s foot length, width and volumetric data in order to determine the shoes that best fit him.

After analysing the measurements, a digital profile of each foot is created and leads thereafter to appropriate individual off-the-shelf shoe.

Other services include insoles’ recommendations and 3D printed insoles manufactured by HP Multi Jet Fusion printing technology.

“FitStation is a truly disruptive platform that will improves people’s lives and change the way people purchase footwear and shoe insoles,” said Louis Kim, Global Head of Immersive Computing, Personal Systems, HP Inc. “We are reinventing the footwear shopping experience, bringing a level of customization and personalization never before seen. We are stitching HP’s capabilities in 3D scanning and 3D printing to bring this Blended Reality vision to life and are working with leading partners within the footwear industry to develop this revolutionary platform.”

Leaders of the footwear market such as Superfeet and Steitz Secura have already given their consent to use FitStation. For Steitz Secura CEO Michael Huth, “the concept of customized safety shoes is a true world innovation and will be the benchmark for the future.”

The supply chain, a huge beneficiary

This innovation will disrupt the traditional supply chain. Indeed, retailers could sell products they do not need to keep in inventory on the one hand; on the other hand, they could predict fewer product returns.

Companies like eSUN and RESA in China preceded the technology giant on this market. However, they all aim at bringing their particular touch in the way the world design and manufactures with 3D technologies.


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