Henkel to develop SLA 3D Printable materials as part of the SYMPA Project

Henkel has joined SYMPA, a research and development project sponsored by the German Federal Ministry of Education and Research (BMBF¹) and the Federal Ministry Republic of Austria Transport, Innovation and Technology (BMVIT²). 

The project’s goal is to explore the low mechanical properties, low durability and low UV stability of SLA materials. It will be completed at the end of 2021 by an SLA toolbox as preliminary stage for tailored 3D printing solutions in the automotive industry.

All partners of the German and Austrian project consortium will join their expertise to produce new materials, printing methodologies and post-processing technologies for durable Stereolithography (SLA) products using Digital Light Processing (DLP) with a focus on automotive applications. 

Other partners include the Institute of Aircraft Design (IFB), Rapid Shape GmbH, Joanneum Research and INOCON Technologie GmbH and cirp GmbH. 

A specific expertise in various fields of the industry

Each of them will bring their expertise in the development of these materials:

Henkel is known for its contribution both at the materials level and at the hardware level.

Rapid Shape GmbH manufactures 3D Printers for the hearing aid industry. Its open AM can meet several conditions with regards to material, customer, and the environment.

The Institute of Aircraft Design (IFB) brings a strong background in lightweight construction and composite applications, including fibre reinforced SLA materials for strongly increased mechanical properties and fatigue limit.

Joanneum Research and INOCON Technologie GmbH are specialists for development and application of plasma technology for coating and activation, i.e. deposition, post-processing and surface modification for better mechanical and environmental resistance, controlled wettability and electric conductivity of polymers.

cirp GmbH as experienced 3D-printing service provider enables technology demonstrations on real automotive structures and improved design processes of SLA components.

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