Additive Manufacturing solutions provider 3D Systems is introducing three major solutions at Formnext 2025: the SLA 825 Dual 3D printer, the ArrayCast™ investment casting solution, and new Accura® materials for SLA.
Achieving larger parts with the SLA 825 Dual
With a new, 20% larger build volume of 830 x 830 x 550 mm, dual-laser architecture, and simplified user workflow, the SLA 825 Dual, is designed for demanding applications in automotive, Formula 1, aerospace, space, and service bureaus.
Built with continuous performance in mind, the SLA 825 Dual is engineered for long-term value and scalability. This means it could be upgradeable for future technology innovations.
3D Systems will present case studies and technology demonstrations in its booth at Formnext.
The investment casting solution
ArrayCast™ redefines investment casting by eliminating the need for tooling.
For over a quarter-century, the Company’s QuickCast® software tool has empowered foundries to create high-precision, lightweight patterns straight from CAD. This eliminates the need for tooling, giving engineers complete design freedom to develop higher-performance parts without the burden of upfront tooling costs.
Using the software ArrayCast™, 3D Systems says foundries could create customized casting trees, complete with configurable runners, sprues, and end effectors tailored to their workflow effortlessly.
Key benefits include:
- Up to 10x faster production cycles by digitally assembling casting trees before printing begins, eliminating bottlenecks caused by manual processes
- Up to 20x reduction in manual labor hours through the use of fully assembled, 3D-printed casting trees, no hand gluing or wax welding required
- Unmatched consistency and repeatability with a digital workflow that minimizes human error and ensures every tree meets exact specifications
Finally, the company also enhanced its SLA materials portfolio with Accura® SbF and Accura Xtreme Black to address casting and prototyping applications with improved efficiency and performance.
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