3D Systems and Oerlikon to drive AM applications in the semiconductor and aerospace sectors.

Credit: 3D Systems

Scaling metal Additive Manufacturing applications in high-criticality industries such as semiconductor and aerospace is the goal of the collaboration agreement signed between 3D Systems and Oerlikon.

3D Systems’ Application Innovation Group (AIG) collaborated with Oerlikon AM’s Application Engineering will leverage their experience in laser powder bed fusion process and material and process qualification for the production of high-criticality parts with lower lifecycle costs.

As part of the agreement, Oerlikon has acquired its fourth 3D Systems DMP Factory 500 system the first Oerlikon AM is adding in the U.S. – to expand its end-to-end supply chain solution. As a reminder, the DMP Factory 500 features a vacuum chamber that  ensures the lowest O2 content, and a 3-laser configuration for the production of seamless large parts as large as 500mm x 500mm x 500mm.

The adoption of Additive Manufacturing technology for series production occurs at an ever-increasing pace. For our customers to remain competitive in core technology markets (including semicon and aerospace), scale up to series production is dependent upon the successful execution of application development, qualification, and timely ramp up to full-scale production,” stated Jonathan Cornelus, business development manager, Oerlikon AM. “With Oerlikon and 3DSystems joining forces, this partnership will accelerate the industrialization of metal AM through an integrated team approach between the customer, printer OEM, and manufacturing partner. The efficiency gains will maximize the benefits of additive manufacturing across design, materials, printing, and post-processing to break performance barriers in the manufacturing supply chain.”

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