NIDEC MACHINE TOOL AMERICA, a provider of advanced manufacturing technologies, rebrands its additive manufacturing unit as Advanced Manufacturing Technologies.
This rebranding emphasizes the company’s portfolio that includes conventional manufacturing processes on top of AM.
The newly named division brings three distinct technology platforms under one umbrella: LAMDA, the company’s metal additive manufacturing system; ABLASER, a high-precision laser micromachining system; and BOND MEISTER, a room-temperature wafer bonding machine built for semiconductor and MEMS applications.
A closer look at each technology
LAMDA is NIDEC’s Laser Powder DED Additive Manufacturing system, built for large-scale metal 3D printing. The series, comprising the LAMDA200, LAMDA500, LAMDA2000, and LAMDA5000, features advanced process control with AI anomaly detection for real-time monitoring and feedback, ensuring stability and repeatability throughout the build. Additionally, its local shield nozzle allows for the printing of reactive materials without a full inert gas enclosure, which simplifies setup and speeds up delivery.
The ABLASER is a laser micromachining system built around proprietary optical head technology and a prism rotator. This enables ultra-high precision helical machining. It drills micro-holes down to ⌀27 μm in materials like silicon, SiC, and ceramics with no thermal distortion. Its flexible taper hole control supports straight, forward taper, reverse taper, and hand-drum-shaped geometries.
BOND MEISTER joins wafers through surface activation bonding inside a high-vacuum environment. The process requires no heat. This eliminates thermal stress and distortion, allowing for the bonding of dissimilar materials like GaN, GaAs, and silicon. The lineup includes the MWB-04/06-R for research, prototyping, and small to medium volume production; MWB-04/06/08-AX for high-throughput production with fully automated cassette-to-cassette operation; and MWB-08/12-ST for 300 mm wafer bonding in high-volume applications.
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